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Globetrotter Module GTM353W
Integration Manual
OPTION W ireless Technology, Kolonel Begaultlaan 45, B-3012 Leuven
Tel +32 16 317 411 Fax +32 16 207 164 http://www.option.com
Option Confidential
About this document
Overview and Purpose
This document is meant for laptop manufacturers and other system integrators, to
allow for easy integration into their own product. The bulk of this document describes
the functional interfaces of the GlobeTrotter GTM353W Module on hardware,
firmware and software levels. At the end, a chapter concerning certification
requirements is added, which should be taken into account from the start of the
integration.
Please note that this is only a draft version and is subject to change.
Confidentiality
All data and information contained or disclosed by this document is confidential and
proprietary of Option NV, and all rights therein are expressly reserved. By accepting
this document, the recipient agrees that this information is held in confidence and in
trust and will not be used, copied, reproduced in whole or in part, nor its contents
revealed in any manner to others without prior and written permission of Option NV
Version History
Date
Release Version
Author(s)
Revision(s)
Remarks
Phase
June 8, 2005
1-Draft
R. Claessens
S. Lodeweyckx
1.0.0
June 9, 2005
2-Draft
R. Claessens
June 16, 2005
3-Draft
R. Claessens
June 22, 2005
4-Final
R. Claessens
Added general
overview diagram,
certification content,
quickstart guide,
general modifications
Added revision
remarks
Added revision
remarks
Added antenna
guidelines, product
pictures
July 8, 2005
September 14,
2005
1-Draft
4-Final
R. Claessens
R. Claessens
November 18,
2005
1-Final
Johan De
Bisschop
January 16,
2005
January 18,
2005
1-Draft
2-Draft
Johan De
Bisschop
Johan De
Bisschop
S. Lodeweyckx,
F. Nys,
J. Vercruysse
D. Michiels
Added default
settings for Option
AT commands
Pinout definition
adapted to newly
approved PCIExpress
Mini Card standard.
References to
GTM352U removed
Update for
GTM353W
Digital PCM
interface added
OPTION W ireless Technology, Kolonel Begaultlaan 45, B-3012 Leuven
Tel +32 16 317 411 Fax +32 16 207 164 http://www.option.com
Option Confidential
1.0.0
1.0.0
1.0.0
1.0.0
1.0.0
GTM353W Integration Manual
Table of contents
INTRODUCTION .................................................................................................5
1.1
General description ........................................................................................5
1.2
Features ..........................................................................................................6
1.2.1
WCDMA................................................................................................6
1.2.2
E-GPRS..................................................................................................6
1.2.3
Terminal Equipment Interfaces..............................................................7
1.2.4
Power Requirements ..............................................................................7
1.2.5
Thermal Dissipation and derating ..........................................................7
1.2.6
LED definition .......................................................................................7
GENERAL OVERVIEW DIAGRAM ..................................................................8
HARDWARE DESCRIPTION .............................................................................9
3.1
Block diagram GTM353W ............................................................................9
3.2
PCIExpress Mini Card interface ....................................................................9
3.3
UICC interface guidelines..............................................................................9
3.3.1
Introduction............................................................................................9
3.3.2
UICC Interface.......................................................................................9
3.3.3
Electrical specifications of the UICC – Terminal interface...................9
3.3.4
Electrical interface .................................................................................9
3.3.5
Practical implementation .......................................................................9
3.4
Digital PCM interface ....................................................................................9
3.4.1
Background ............................................................................................9
3.4.2
Interfaces, Features & Functions ...........................................................9
3.5
Antenna guidelines.........................................................................................9
3.5.1
Antenna specifications ...........................................................................9
3.5.2
WLAN Antenna Isolation ......................................................................9
3.5.3
Antenna connector .................................................................................9
HOST CONTROL INTERFACES ........................................................................9
4.1
USB interface.................................................................................................9
4.2
COM interface ...............................................................................................9
4.3
NDIS interface ...............................................................................................9
DEVICE DRIVER INTERFACE ..........................................................................9
AT COMMAND SET REFERENCE....................................................................9
6.1
DTE-TA/DCE Interface Commands..............................................................9
6.2
General commands.........................................................................................9
6.3
Call control commands ..................................................................................9
6.4
Network service related commands ...............................................................9
6.5
Mobile equipment commands........................................................................9
6.6
UMTS packet domain commands..................................................................9
6.7
SMS Commands ............................................................................................9
6.8
Synchronous data mode commands...............................................................9
6.9
SIM Toolkit commands .................................................................................9
6.10 Option proprietary commands .......................................................................9
6.10.1 Read hardware version _OHWV ...........................................................9
6.10.2 Preferred SYStem AT_OPSYS..............................................................9
Author:
Creation Date:
R. Claessens
September 20, 2006
Option Confidential:
This document is Option Confidential - it may not be duplicated, neither distributed externally without prior and written permission of
Option NV.
Version:
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GTM353W Integration Manual
6.10.3 Security “AT_OSEC” ............................................................................9
6.10.4 Selected System “AT_OSSYS”............................................................9
6.10.5 Aircraft Mode “AT_OAIR”..................................................................9
6.10.6 Enable/Disable CHAP “AT_OCHAP” ..................................................9
6.10.7 SIM toolkit profile download “AT+STPD”...........................................9
PHYSICAL CHARACTERISTICS.......................................................................9
7.1
Dimensions ....................................................................................................9
7.2
Power consumption........................................................................................9
7.3
Thermal dissipation requirements..................................................................9
7.4
Operating and Storage Environment..............................................................9
7.4.1
Shock......................................................................................................9
7.4.2
Vibration ................................................................................................9
7.4.3
Operating Temperature and Humidity ...................................................9
7.4.4
Non-Operating Temperature and Humidity...........................................9
7.4.5
Altitude ..................................................................................................9
CERTIFICATION .................................................................................................9
BOARD ASSEMBLY ...........................................................................................9
10
ABBREVIATIONS ...........................................................................................9
11
REFERENCES ..................................................................................................9
Author:
Creation Date:
R. Claessens
September 20, 2006
Option Confidential:
This document is Option Confidential - it may not be duplicated, neither distributed externally without prior and written permission of
Option NV.
Version:
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GTM353W Integration Manual
1 INTRODUCTION
1.1 General description
The GTM 35X is a PCIExpress Mini Card providing WWAN (WCDMA & EGPRS)
connectivity to laptops or any other device equipped with a PCIExpress Mini Card slot.
Figure 1: Bottom view
Figure 2: Top view
Based on standard Qualcomm WCDMA and EGPRS technologies, both modules provide
quad-band (850/900/1800/1900 MHz) EGPRS connectivity for worldwide operation. The
GTM 353W module delivers 850/1900/2100 MHz WCDMA FDD connectivity.
Author:
Creation Date:
R. Claessens
September 20, 2006
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Option NV.
Version:
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GTM353W Integration Manual
1.2 Features
1.2.1 WCDMA
- Model GTM 353W Module (WORLD version)
•
•
•
•
•
•
FDD 850/1900/2100 MHz
Power Class 3 (+24dBm)
384/128 kbps downlink/uplink modem operation (potentially 384 kbps uplink)
Supports UL and DL Compressed Modes
Supports Circuit and Packet-Switched Data
Upgradeable to HSDPA 1.8Mbps
1.2.2 E-GPRS
•
•
•
•
•
•
•
•
850/900/1800/1900 MHz
GSM Power Class 4 (2W) for 850/900 bands, GSM
Power Class 1 (1W) for 1800/1900 bands
EDGE class E2 (+27 dBm in 850/900 bands, +26 dBm in 1800/1900 bands)
GPRS/EGPRS Multislot Class 10 (4 slots Rx, 2 slots Tx, 5 max active)
GPRS/EGPRS Class B Type 1 MT
GPRS CS1-CS4; EGPRS MCS1-MCS9
Circuit Switched Data: 14.4 and 9.6 kbps
Author:
Creation Date:
R. Claessens
September 20, 2006
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Option NV.
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GTM353W Integration Manual
1.2.3 Terminal Equipment Interfaces
•
•
•
•
•
•
•
Physical interface PCIExpress Mini Card 1.1
USB 2.0 Full Speed (12Mbits/s) signalling
NDIS and Modem interface drivers
AT interface with standard modem emulation
EAP-SIM / EAP-AKA support
Operating Systems supported:
o Windows 2000/XP/XP Pro/Tablet
o Mac OS X Tiger
o Linux (on demand)
Regulatory & Certifications
o R&TTE, FCC, GCF
o Mechanical and Environmental testing
1.2.4 Power Requirements
•
•
•
Vcc 3.3V +/- 9%
Peak Icc 2750 mA with max supply droop 50 mV
Average Icc 850 mA
1.2.5 Thermal Dissipation and derating
•
•
The maximum thermal dissipation directly from any PCI Express Mini Card add-in
card is 2.9 W peak
See section 7.3 for details on actual thermal dissipation.
1.2.6 LED definition
The module can control one LED via the bus connector.
Author:
Creation Date:
R. Claessens
September 20, 2006
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Option NV.
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GTM353W Integration Manual
2 GENERAL OVERVIEW DIAGRAM
Figure 3 gives a high level system overview. Option provides the communication and
physical layer. On the physical layer, the bottom interfaces (in dark color) are explicit
notations to show the integrator which physical connection capabilities can be used.
Application
(eg. Hyperterminal,
SMS app.,
dashboard)
USER APPLICATION
USER APPLICATION
(e-mail, http,...)
(SMS, signal strength,...)
AT commands
TCP
UDP
/ IP
NDIS
Communication Layer
COM
PPP
APPLICATION
DEBUG
PPP
USB
PCIExpress Mini Card
Physical
Layer
Embedded Stack
Hardware platform
LED
(U)SIM
connector
Mini PCIExpress
connector
RF
connector
Figure 3: High level system overview
The Communication Layer components are described in chapter 4 and chapter 5. An overview
of the supported AT commands is given in chapter 6
Author:
Creation Date:
R. Claessens
September 20, 2006
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Option NV.
Version:
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GTM353W Integration Manual
3 HARDWARE DESCRIPTION
For abbreviations used in this chapter, please refer to the terms and abbreviations chapter.
3.1 Block diagram GTM353W
Figure 5: Hardware block diagram GTM353W
Author:
Creation Date:
R. Claessens
September 20, 2006
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GTM353W Integration Manual
3.2 PCIExpress Mini Card interface
While the full PCI Express bus may be routed to the system connector from the host system,
the GTM card will only use the USB 2.0 Full Speed (12Mbit/s) interface (See Table 1 - NC is
Not Connected).
Pin assignment in
PIN
PCIExpress Mini
Card spec
WAKE#
3.3Vaux
Pin assignment on
GTM35x
NC
3.3V
Additional Description
WAKE functionality is NOT supported in USB
based Mini Cards per the PCI-SIG specification.
3.3V DC supply rail from the host system. Further
description of the sourcing characteristics of this rail
is provided in this document.
No Connect
RESERVED
NC
GND
GND
RESERVED
NC
No Connect.
1.5V
NC
1.5V DC is not to be used
Mini Card ground.
CLKREQ#
NC
As in the MINI Card Specification.
UIM_PWR
GND
UICC_PWR
GND
Power source for external UIM/SIM.
Mini Card ground.
10
UIM_DATA
UICC_DATA
External UIM/SIM data signal.
11
REFCLK-
NC
No Connect.
12
UIM_CLK
UICC_CLK
External UIM/SIM clock signal.
13
REFCLK+
NC
No Connect.
14
UIM_RESET
15
GND
UICC_RESET
GND
External UIM/SIM reset signal.
Mini Card ground.
16
UIM_Vpp
NC
External UIM/SIM programming voltage.
17
RESERVED
NC
As in the Mini Card Specification.
18
GND
GND
Mini Card ground.
19
RESERVED
NC
20
W_DISABLE#
HW_RadioXMIT_Disable#
21
GND
GND
22
PERST#
NC
No Connect.
23
PERn0
NC
No Connect.
24
25
3.3Vaux
PERp0
NC
NC
No Connect
26
27
GND
GND
GND
GND
Mini Card ground.
Mini Card ground.
28
1.5V
NC
1.5V DC supply rail is not to be used
29
GND
GND
30
SMB_CLK
NC
31
PETn0
NC
32
SMB_DATA
NC
33
PETp0
NC
As in the Mini Card Specification.
Active low input from the platform to the card to
disable all the radios on the MPCI card from
transmitting.
Mini Card ground.
Mini Card ground.
SMB support is not required for the WWAN Mini
Card module.
No Connect.
SMB support is not required for the WWAN Mini
Card module.
No Connect.
Author:
Creation Date:
R. Claessens
September 20, 2006
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Option NV.
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GTM353W Integration Manual
Pin assignment in
PIN
PCIExpress Mini
Card spec
Pin assignment on
GTM35x
Additional Description
34
35
GND
GND
GND
GND
Mini Card ground.
Mini Card ground.
36
37
USB_DGND
USB_DGND
38
USB_D+
USB_D+
As in the Mini Card Specification.
39
3.3Vaux
3.3V
3.3V rail
40
GND
GND
Mini Card ground.
41
3.3Vaux
3.3V
42
LED_WWAN#
LED_WWAN_RadioState
As in the Mini Card specification.
Mini Card ground
43
GND
GND
3.3V rail
Active-low LED drive signal for indicating the state of
the WWAN Radio.
Mini Card GND
44
LED_WLAN#
NC
No Connect.
45
AUX_PCM_CLK
NC
AUX_PCM_CLK
46
LED_WPAN#
NC
No Connect.
47
AUX_PCM_DIN
NC
AUX_PCM_DIN
48
1.5V
NC
1.5V DC is not to be used
49
AUX_PCM_DOUT
NC
AUX_PCM_DOUT
50
GND
GND
Mini Card Ground
51
AUX_PCM_SYNC
NC
52
3.3Vaux
3.3V
AUX_PCM_SYNC
3.3V DC supply rail from the host system. Further
description of the sourcing characteristics of this rail
is provided in this document.
· Table 1: PCIExpress Mini Card pinout
Remark: Increased electrical power and ground
Initial design reviews show that the current requirements exceed the limits set by the older
versions of the PCI Express Mini Card standard v. 1.1. In order to reduce impedances
additional pins are needed for power and grounding. Pins are required for supporting the
current 1.1A / 2.75A (average / peak) instead of 750mA / 1A. In the new version of the
standard, additional supply and grounding pins have been defined for this reason. Those pins
are pin 39/41 for additional 3.3V, and 37/43 for additional GND connections
Author:
Creation Date:
R. Claessens
September 20, 2006
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GTM353W Integration Manual
3.3 UICC interface guidelines
3.3.1 Introduction
This section describes how to design the UICC (USIM)-card interface for connection with the
GTM.
The baseband processor has an integrated UICC interface compatible with the ISO7816 IC
card standard. This is wired to the PCIExpress Mini Card connector (PCIE connector) in
order to be connected to an external UICC card holder (see Figure 5: (U)SIM pin assignment).
Five pins on the PCIE connector are reserved for the (U)SIM interface (pins 8,10,12, 14 and
15 - see Table 1 and Table 3).
The (U)SIM interface of a GSM/GPRS/EDGE/UMTS/HSDPA module needs some special
requirements. The (U)SIM card is connected with the digital part of the module. An RF
interference signal picked-up by the (U)SIM card reader can disturb normal operation of the
module and result in unexpected errors.
The (U)SIM card is accessible by the customer. In many cases an efficient RF-shielding of the
(U)SIM card is not possible. However, with some precautions problems caused by
interference signals picked up by the (U)SIM card can be significantly reduced.
3.3.2 UICC Interface
3.3.2.1 UICC Card Holder
The UICC Card interface has got 6 contacts. Officially according to 3GPP there are 8 pads,
so you will find eight (8) pads on the PCB-Layout picture (Figure 4) and in the specification
of the PCI Express Mini Card, numbered from C1 to C8. Contacting elements in positions C4
and C8 are not used. They shall present high impedance to the UICC. Figure 5 and Table 3
show the pin assignment of a UICC card.
However as a way of an example “how to connect” the company JAE has introduced
(http://www.jae-connector.com/) 6 pins UICC connectors. These are numbered JAE-1
through JAE-6. For convenience the JAE numbering is added on the PCB-Layout picture
(Figure 4).
All the active circuitry is placed on the GTM. Only passives should be further applied.
Author:
Creation Date:
R. Claessens
September 20, 2006
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GTM353W Integration Manual
Figure 4: PCB layout pad assignment hosting a UICC
Contact
Element
PCIE
pin number
PCIE
Signal name
C1
Pin#08
UIM_PWR
C2
Pin#14
UIM_RESET
C3
Pin#12
UIM_CLK
C7
Pin#10
UIM_DATA
Function
Power supply of the UICC
UICC reset, prompted by the GTM
Clock signal, generated by the GTM
Bi-directional data signal
Table 2: UICC mapped to B2B pinout
Figure 5: (U)SIM pin assignment
Author:
Creation Date:
R. Claessens
September 20, 2006
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GTM353W Integration Manual
Pin
no.
Contact
Element
Signal name
(U)SIM
I/O
C1
VCC
Power supply of the SIM, generated by the GTM
C2
RST
SIM reset, prompted by the GTM
C3
CLK
clock signal, generated by the GTM
C5
GND
Ground
C6
PROG
Not Used
C7
I/O
I/O
Function
bi-directional data signal, generated by either
GTM or (U)SIM
Table 3: (U)SIM pin description
The 3GPP standard defines 3 operation voltages for the supply voltage of the SIM card: 1.8V,
3V and 5V. The GTM module supports only 2 voltages, 1.8V and 3V. 5V only SIM cards
are barely used nowadays.
Note that the GTM does not have a UICC card holder. The UICC signals are connected with
the “PCI Express MiniCard” connector (the edge connector).
J1001
+3.3V
GND
+1.5V
LED_WPAN#
LED_WLAN#
LED_WWAN#
GND
USB_D+
USB_DGND
SMB_DATA
SMB_CLK
+1.5V
GND
+3.3Vaux
PERST#
W_DISABLE#
GND
GND
REFCLK+
REFCLKGND
CLKREQ#
Reserv ed
Reserv ed
WAKE#
UIM_VPP
UIM_RESET
UIM_CLK
UIM_DATA
UIM_PWR
+1.5V
GND
+3.3V
52
50
48
46
44
42
40
38
36
34
32
30
28
26
24
22
20
18
VREG_RUIM
C2
Reserv ed
Reserv ed
Reserv ed
Reserv ed
Reserv ed
Reserv ed
Reserv ed
Reserv ed
GND
PETp0
PETn0
GND
GND
PERp0
PERn0
GND
UIM_C4
UIM_C8
U1002
EMIF03-SIM01
C7
51
49
47
45
43
41
39
37
35
33
31
29
27
25
23
21
19
17
A3
B3
VREG_RUIM
C3
C1
C6
C2
C5
C3
C4
A2
UIM_RESET
B1
UIM_CLK
C1
UIM_DATA
16
14
12
10
B2
15
13
11
PCI_Ex_MiniCard_EdgeConnector
Figure 6: UICC Signal Routing on GTM
3.3.2.2 EMI filtering and ESD protection
The EMIF03-SIM01 (U1002 on Figure 6) is a highly integrated array designed to suppress
EMI/RFI noise. Greater than 25dB attenuation is obtained at frequencies from 800MHz to
Author:
Creation Date:
R. Claessens
September 20, 2006
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GTM353W Integration Manual
2.2GHz. Additionally, this filter includes an ESD protection circuitry which prevents the
protected device from destruction when subjected to ESD surges up to 8kV (Contact) and
15kV (Air).
· Figure 7: Schematic of EMIF03-SIM01
Figure 8: Insertion Loss Characteristic
3.3.3 Electrical specifications of the UICC – Terminal interface
This section is an excerpt from the standards, but it is very important that the integrator takes
care in the design phase to comply to these specifications, since they are essential to the final
certification of the integrated module (also see chapter 8 on certification).
Author:
Creation Date:
R. Claessens
September 20, 2006
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GTM353W Integration Manual
3.3.3.1 Contact activation and deactivation
The Terminal shall connect, activate and deactivate the UICC in accordance with the
Operating Procedures specified in ISO/IEC 7816-3 [12].
For any voltage level, monitored during the activation sequence, or during the deactivation
sequence following normal power-down, the order of the contact activation/deactivation shall
be respected.
It is recommended that whenever possible, the deactivation sequence defined in
ISO/IEC 7816-3 [12] should be followed by the Terminal on all occasions when the Terminal
is powered down.
If the UICC clock is already stopped and is not restarted, the Terminal may deactivate all the
contacts in any order, provided that all signals reach low level before Vcc leaves high level. If
the UICC clock is already stopped and is restarted before the deactivation sequence, then the
deactivation sequence specified in ISO/IEC 7816-3 [12] sub clause 5.4 shall be followed.
3.3.3.2 Inactive contacts
The voltages on contacts C1, C2, C3, C6 and C7 of the Terminal shall be in the range 0 ± 0,4
volts referenced to ground (C5) when the Terminal is switched off with the power source
connected to the Terminal. The measurement equipment shall have a resistance of 50 kohms
when measuring the voltage on C2, C3, C6 and C7. The resistance shall be 10 kohms when
measuring the voltage on C1.
3.3.3.3 Contact pressure
The contact pressure shall be large enough to ensure reliable and continuous contact (e.g. to
overcome oxidisation and to prevent interruption caused by vibration). The radius of any
curvature of the contacting elements shall be greater than or equal to 0,8 mm over the contact
area.
Under no circumstances shall the contact force exceed 0,5 N per contact.
Care shall be taken to avoid undue point pressure to the area of the UICC opposite to the
contact area. Such pressure is potentially damaging to the components within the UICC.
Author:
Creation Date:
R. Claessens
September 20, 2006
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GTM353W Integration Manual
3.3.3.4 Power Supply
The supply voltage of power supply is shown in Table 4.
Symbol
Minimum
Maximum
Unit
Vcc
Vcc
2,7
1,62
3,3
1,98
Voltage
Class
Table 4: Supply Voltage Classes indicated in ATR
• Power Consumption of the UICC during ATR
The maximum power consumption of the UICC during ATR is specified in Table 5
and Table 6. The UICC power consumption during the ATR shall conform to the
voltage class indicated in the ATR. If the UICC supports several supply voltage
classes, each class shall conform to the corresponding maximum ATR power
consumption, as specified in Table 5 and Table 6. This is required because the
terminal is not aware of the power consumption of the UICC until the ATR is
received and an application is selected.
Symbol
Icc
Icc
Voltage Class
Maximum
7.5
Unit
mA
mA
Table 5: Power Consumption that applies during ATR at max. external clock
Symbol
Icc
Icc
Voltage Class
Maximum
Unit
mA
mA
Table 6: Power Consumption that applies during ATR at 4 MHz
3.3.3.5
Specification of the 3V UICC – Terminal Interface
• Supply voltage Vcc (contact C1)
The Terminal shall operate the UICC within the following limits:
Symbol
Minimum
Maximum
Unit
Vcc
2,7
3,3
Table 7: Electrical characteristics of Vcc under normal operating conditions
The module is capable of sourcing the maximum current as defined in Table 6. It is also able
to counteract spikes in the current consumption of the SIM card up to a maximum charge of
12 nAs with no more than 400 ns duration and an amplitude of at most 60 mA, ensuring that
the supply voltage stays in the specified range.
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R. Claessens
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• Reset (RST) (contact C2)
The Terminal shall operate the UICC within the following limits:
Symbol
Conditions
Minimum
Maximum
Unit
VOH
IOHmax = + 20 µA
0,8 x Vcc
Vcc (Note)
VOL
IOLmax = -200 µA
0 (Note)
0,2 x Vcc
TR tF
Cin = Cout = 30 pF
400
µs
NOTE: To allow for overshoot the voltage on RST should remain between -0,3V and Vcc +0,3V
during dynamic operations.
Table 8: Electrical characteristics of RST under normal operating conditions
• Clock CLK (contact C3)
The Terminal shall support 1 to 5 MHz. The Terminal shall supply the clock. No "internal
clock" UICC shall be used.
The duty cycle shall be between 40 % and 60 % of the period during stable operation.
The Terminal shall operate the UICC within the following limits:
Symbol
Conditions
Minimum
Maximum
Unit
VOH
IOHmax = + 20 µA
0,7 x Vcc
Vcc (Note )
VOL
IOLmax = - 20 µA
0 (Note )
0,2 x Vcc
TR tF
Cin = Cout = 30 pF
50
ns
NOTE:
To allow for overshoot the voltage on CLK should remain between -0,3V and Vcc+0,3V
during dynamic operations.
Table 9: Electrical characteristics of CLK under normal operating conditions
• I/O (contact C7)
Table 3.6 defines the electrical characteristics of the I/O (contact C7). The values given in the
table allow the derivation of the values of the pull-up resistor in the Terminal and the
impedance of the drivers and receivers in the Terminal and UICC.
Author:
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R. Claessens
September 20, 2006
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Symbol
Conditions
Minimum
Maximum
Unit
VIH
IIHmax = ± 20 µA (Note 2)
0,7 x Vcc
Vcc+0,3
VIL
IILmax = + 1 mA
- 0,3
0,2 x Vcc
VOH (Note 1)
IOHmax = + 20 µA
0,7 x Vcc
Vcc (Note 3)
VOL
IOLmax = - 1mA
0 (Note 3)
0,4
TR tF
Cin = Cout = 30 pF
µs
NOTE 1: It is assumed that a pull-up resistor is used on the interface device (recommended value:
20 k Ω).
NOTE 2: During static conditions (idle state) only the positive value can apply. Under dynamic
operating conditions (transmissions) short term voltage spikes on the I/O line may cause
a current reversal.
NOTE 3: To allow for overshoot the voltage on I/O shall remain between -0,3V and Vcc+0,3V
during dynamic operation.
Table 10: Electrical characteristics of I/O under normal operating conditions
3.3.3.6
•
Specification of the 1.8V UICC – Terminal Interface
Supply voltage Vcc (contact C1)
The Terminal shall operate the UICC within the following limits:
Symbol
Vcc
Minimum
1,62
Maximum
1,98
Unit
Table 11: Electrical characteristics of Vcc under normal operating conditions
The module is capable of sourcing the maximum current as defined in Table 6. It is also able
to counteract spikes in the current consumption of the SIM card up to a maximum charge of
12 nAs with no more than 400 ns duration and an amplitude of at most 60 mA, ensuring that
the supply voltage stays in the specified range.
• Reset (RST) (contact C2)
The Terminal shall operate the UICC within the following limits:
Symbol
Conditions
Minimum
Maximum
Unit
VOH
IOHmax = + 20 µA
0,8 x Vcc
Vcc (Note)
VOL
IOLmax = -200 µA
0 (Note)
0,2 x Vcc
TR Tf
Cin = Cout = 30 pF
400
µs
NOTE:
To allow for overshoot the voltage on RST should remain between -0,3V and Vcc +0,3V
during dynamic operations.
Table 12: Electrical characteristics of RST under normal operating conditions
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• Clock CLK (contact C3)
The Terminal shall support 1 to 5 MHz. The Terminal shall supply the clock. No "internal
clock" UICC shall be used.
The duty cycle shall be between 40 % and 60 % of the period during stable operation.
The Terminal shall operate the UICC within the following limits:
Symbol
Conditions
Minimum
Maximum
Unit
VOH
IOHmax = + 20 µA
0,7 x Vcc
Vcc (Note )
VOL
IOLmax = - 20 µA
0 (Note )
0,2 x Vcc
TR Tf
Cin = Cout = 30 pF
50
ns
NOTE:
To allow for overshoot the voltage on CLK should remain between -0,3V and Vcc+0,3V
during dynamic operations.
Table 13: Electrical characteristics of CLK under normal operating conditions
• I/O (contact C7)
Table 14 defines the electrical characteristics of the I/O (contact C7). The values given in the
table allow the derivation of the values of the pull-up resistor in the Terminal and the
impedance of the drivers and receivers in the Terminal and UICC.
Symbol
Conditions
Minimum
Maximum
Unit
VIH
IIHmax = ± 20 µA (Note 2)
0,7 x Vcc
Vcc+0,3
VIL
IILmax = + 1 mA
- 0,3
0,2 x Vcc
IOHmax = + 20 µA
0,7 x Vcc
Vcc (Note 3)
VOL
IOLmax = - 1mA
0 (Note 3)
0,4
TR tF
Cin = Cout = 30 pF
µs
VOH (Note 1)
NOTE 1: It is assumed that a pull-up resistor is used on the interface device (recommended value:
20 k Ω).
NOTE 2: During static conditions (idle state) only the positive value can apply. Under dynamic
operating conditions (transmissions) short term voltage spikes on the I/O line may cause
a current reversal.
NOTE 3: To allow for overshoot the voltage on I/O shall remain between -0,3V and Vcc+0,3V
during dynamic operation.
Table 14: Electrical characteristics of I/O under normal operating conditions
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3.3.4 Electrical interface
The (U)SIM card holder is connected with the module by means of long wires. The (U)SIM
card holder and wires are radiated on with different types of noisy signals, e.g. the radiation
signals of the module antenna. The SIM interface signals conduct this noise into the module
and radiate these signals into the module, with potential disasterous results.
This phenomenon can be significantly reduced by following design rules for EMC
interference minimisation:
1. Place noise suppression capacitors on the SIM card holder.
2. Route the SIM card holder signals carefully in relation to other signalling lines and
potential noise generation sources.
3. Limit the line length: a maximum length of 200mm is advised.
3.3.4.1 Noise suppression capacitors
On the module suppression capacitor are placed on the signals RTS, CLK and I/O. The value
of these suppression capacitors equals 17pF each.
Although the module foresees suppression capacitors it is important to place suppression on
the contacts of the SIM card holder. The value of these suppression capacitors must be equal
to 10pF. It is important to place the capacitors as short as possible to the SIM card reader.
Every mm PCB track (or FFC signalling line) counts. The size of the capacitor also matters. It
is advisable to use 0402 type capacitors.
Figure 9 shows the impedance graph of a 10pF capacitor.
Figure 9: Impedance of 10pF capacitor
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3.3.4.2 Maximum Trace Length
The maximum trace length depends on the trace capacitance, but on average it is advisable to
limit the length to a maximum of 200mm.
The module controls the signals RST and CLK. A totem-pole output drives these signals high
or low. The signal I/O is a bi-directional data line. The I/O interface is shown in Figure 10.
The module and the (U)SIM (in the SIM card holder), located on both ends of the lines,
control this data line. Either the module or the (U)SIM can pull this line low, through an
open-collector. The line is pulled-up by a resistor of 12kΩ.
Module
SIM card
Figure 10: I/O interface
During certification of the module the SIM interface is tested. A SIM card is simulated by the
test equipment. The test conditions are shown in Table 15 and Table 16. The test equipment
loads the I/O line with 30pF.
Contacts
C1 (Vcc)
C2 (RST)
C3 (CLK)
C5 (GND)
C6 ((Vpp)
C7 (I/O)
ME input
ME output
Low level
--I = -200 µA
I = -20 µA
-----
High level
I = 6 mA
I = +200 µA
I = +20 µA
-----
V=0V
I = -1 mA
I = +20 µA
I = +20 µA
Max. capacitive load
30 pF
30 pF
30 pF
Table 15: Nominal test conditions on 3V SIM/ME interface
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Contacts
C1 (Vcc)
C2 (RST)
C3 (CLK)
C5 (GND)
C6 ((Vpp)
C7 (I/O)
ME input
ME output
Low level
--I = -200 µA
I = -20 µA
-----
High level
I = 4 mA
I = +200 µA
I = +20 µA
-----
V=0V
I = -1 mA
I = +20 µA
I = +20 µA
Max. capacitive load
30 pF
30 pF
30 pF
Table 16: Nominal test conditions on 1V8 SIM/ME interface
The maximum rise-time of I/O equals 1µs. This result in a maximum capacitive load of 70pF
on the I/O line. The maximum capacitance is the sum of all capacitors:
• Suppression capacitor on GTM, typical 17pF
• SIM driver logic on GTM, typical 5pF
• Suppression capacitor on SIM card holder, 10pF.
• Test equipment, maximum 30pF load.
• Connectors
The sum of al these capacitors, without the trace capacitance, equals 62pF. The trace
capacitance is 70pF minus all other capacitance. The maximum trace capacitance equals 70 –
62 = 8pF. This capacitance typically gives lead to a maximum length of 200mm in the worst
case.
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3.3.5 Practical implementation
The (U)SIM signals on the GTM are connected to the PCI Express MiniCard edge connector.
The method of routing the signals to the SIM card holder depends on which connecter is
used.
Note that only one of the two connectors can be used at once, the other needs to be left
floating.
3.3.5.1 PCI Express MiniCard edge connector Signal Routing
When using this connector the SIM signals are routed throughout the PCB. In this
environment it is possible to shield the signals in an efficient way. An example of possible
PCB stackup is shown in Figure 11: PCB Stackup.
VCC
CLK
RST I/O
GND Plane
Signal layer
GND Plane
Vias
Figure 11: PCB Stackup
Note: Ground vias are placed every 2 – 3 mm along the signal traces.
Figure 12: Possible Schematic of a UICC cardholder
Note the 47pF suppression capacitor near contact C1 of the UICC cardholder.
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3.3.5.2 FH19 Signal Routing
The connection between the GTM and UICC cardholder is made by an FFC (flexible flat
cable). Shielding in this environment is much more problematic. In many cases the signals are
not shielded at all. However, the ground wires between every active signal grants certain
immunity against noise.
However an additional PCB board should be designed to host cardholder and some
decoupling capacitors.. The 8-contacts connector from Hirose’s FH19 Series is the same as on
the GTM module. Keep in mind the flat cable has a symmetrical usage.
Figures below show an example for an UICC card holder PCB board and interface. The
schematic and a layout are shown in these pictures.
· Figure 13: Possible Schematic of a UICC card holder PCB board
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Figure 14: Example of a (U)SIM card holder layout
Figure 15: Example of a FFC
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3.4 Digital PCM interface
3.4.1 Background
The module shall interface towards the main processor through the USB
interface and it shall also have an audio interface (PCM) towards the
SLIC/SLAC device. Although some signalling can de done in band over the
PCM interface, the application AT-command interface over the USB is to be
used for settings, dialling out, accepting voice calls and reply messages as
RING, BUSY and DISCONNECT.
External
antenna
WCDMA
HSDPA
module
Connector
SIM card
holder
Main
Processor
PCM
USB
SPI
SLIC/
SLAC
PHY
RJ11
Ethernet
POTS
port
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3.4.1.1 Mechanical form factor for data and voice module
PRELIMINARY PINOUT :
The PCM interface (for voice) will be set on pin 45, 47, 49 and 51 of the PCIe
Express MiniCEM IO interface.
There are 4 pins defined PCM_CLK, for uplink voice PCM_UPLINK,
downlink voice PCM_DOWNLINK and PCM_SYNC. The PCM_CLK and
PCM_SYNC are generated by the module and therefore it act as MASTER.
The CODEC port supports 2.048MHz PCM clock and 8KHz sync timing for
linear, companded (A-law and µ-law) CODEC’s that match the sync timing.
3.4.2 Interfaces, Features & Functions
3.4.2.1 Telephony features
It is possible to originate and terminate calls via AT commands.
The module drives the PCM clock and sync (MASTER). When the module
goes to sleep, clock is lost and the PCM interface becomes inactive. Leaving
the PCM interface active on at all times would force standby time to be close
to talk time.
The AT-commands ATD and ATA will connect the PCM interface and makes
the PCM_DOWNLINK data-pin active by reversing the pin’s tri-state. The
ATH command disconnects the remote user: all calls are released (active, onhold and waiting calls).
3.4.2.1.1 PCM/Audio interface
The module has a PCM interface for a direct connection to an external
SLAC/SLIC that provides a single POTS port.
A 16-bit linear or 8-bit A-law or µ-law with padding can be selected for the
primary PCM interface. (See AT commands doc subsection ‘Voice’)
For all three, the format of the 16 bits on the PCM_UPLINK hardware line is
0xSDDD DDDD DDDD DDVV, where S is the signed bit, D is data, and V is
for volume padding. Also, for PCM_DOWNLINK, PCM has the 16-bit format
of 0xSDDD DDDD DDDD DVVV, where S is the signed bit, D is data, and V
is for volume padding.
Each interface path always accepts/outputs data in 20 millisecond frames.
This translates to 320 bytes per frame
(8 k samples/second * 16 bits/sample * 20 ms).
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· Figure 16 PCM_SYNC timing
· Figure 17 PCM_UPLINK, Codec to Module timing
· Figure 18 PCM_DOWNLINK, Module to Codec timing
Parameter
t(sync)
t(synca)
t(syncd)
t(clk)
t(clkh)
t(clkl)
t(susync)
t(hsync)
t(sudin)
t(hdin)
t(pdout)
t(zdout
Description
Min
Typical
Max
Units
PCM_SYNC cycle time
-62.4
62.4
-3.8
3.8
125
62.5
62.5
7.8
3.9
3.9
-------
µs
µs
µs
µs
µs
µs
ns
ns
ns
ns
ns
PCM_SYNC asserted time
PCM_SYNC deasserted time
PCM_CLK cycle time
PCM_CLK high time
PCM_CLK low time
PCM_SYNC setup time to PCM_CLK rising
PCM_SYNC hold time after PCM_CLK rising
PCM_UPLINK setup time to PCM_CLK falling
PCM_UPLINK hold time after PCM_CLK falling
Delay from PCM_CLK rising to PCM_DOWNLINK
valid
Delay from PCM_CLK falling to PCM_DOWNLINK
HIGH-Z
ns
· Table 17 PCM Codec timing parameters
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3.4.2.1.2 Voice codecs
The module suppor